Sputtering apparatus, method of operating the same, and method of manufacturing substrate using the same

ABSTRACT

A sputtering apparatus includes a susceptor for receiving a substrate, and a first target device disposed to be opposite to a center region of a substrate and at least second and third target devices disposed to be opposite to peripheral regions of the substrate, wherein the second and third target devices are rotatable.

This invention claims the benefit of Korean Patent Application No.10-2006-045490 filed in Korea on May 22, 2006, which is herebyincorporated by reference in its entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

Embodiments of the present invention relate to a processing apparatus,and more particularly, to a sputtering apparatus for processing alarge-scale substrate, a method of operating the sputtering apparatus,and a method of manufacturing a substrate using the sputteringapparatus.

2. Description of the Related Art

A display panel, such as a liquid crystal display device (LCD) or aplasma display panel (PDP) is built upon a substrate through a pluralityof processes, such as a deposition process and an etching process. Eachof the processes is performed using a separate processing apparatus.Among the apparatuses, a sputtering apparatus for forming a thin film isessential for manufacturing the display panel.

FIG. 1 is a cross-sectional view of a sputtering apparatus according tothe related art. Referring to FIG. 1, the sputtering apparatus includesa susceptor 2 and a plurality of target devices 4 that are disposed toface the susceptor 2. A substrate 1 to be processed is securely seatedon the susceptor 2, and a predetermined positive voltage is supplied tothe susceptor 2.

As shown in FIG. 1, the target devices 4 are arranged along a line insuch a way that they face the susceptor 2 or the substrate 1 on thesusceptor 2. The width “w2” of a gap between adjacent target devices 4is very small so that target particles are uniformly deposited on thesubstrate 1. For example, the width “w2” f a gap between adjacent targetdevices 4 is much smaller than the width “w1” of each of the targetdevices 4.

Each target device 4 includes a target 5, a baking plate 6, and a magnet7. Thus, the sputtering apparatus including a plurality of targetdevices 4 has a plurality of targets 5, a plurality of baking plates 6,and a plurality of magnets 7. A predetermined negative voltage isapplied to each target 5, and target particles are emitted from eachtarget 5 because of collisions between each target 5 and ions.

The target 5 is fixed on the front surface of the baking plate 6 thatfaces the susceptor 2. Each baking plate 6 supports the target 5 anddissipates heat from the target 5. The magnet 7 is disposed on the rearsurface of the baking plate 6 such that the magnet 7 induces electronsto be collected to facilitate a plasma discharge in an internal space 8between the target 5 and the susceptor 2. The space 8 between the target5 and the susceptor 2 is filled with inert gas, such as Ar gas, forplasma discharge.

When a predetermined high voltage is applied between the susceptor 2 andthe target 5 as a result of the predetermined negative voltage appliedto each target 5 and the predetermined positive voltage supplied to thesusceptor 2, the Ar gas in the space 8 between the target 5 and thesusceptor 2 is ionized into Ar⁺ ions that form a plasma. Because moreelectrons are collected by the magnetic field of the magnet 7, thegenerated plasma can become high-density plasma. A region of thehigh-density plasma contains Ar⁺ ions. A predetermined potentialdifference occurs between the high-density plasma region and the target5 supplied with the predetermined negative voltage. The Ar⁺ ionscontained in the high-density plasma region are accelerated by theenergy of the predetermined potential difference so as to collideagainst the target 5. These collisions cause the target 5 to emit targetparticles, and the emitted target particles are deposited on thesubstrate 1.

As the size of a substrate to be processed increases, the size of thesputtering apparatus for processing a substrate must also increase. Inparticular, the number of the target devices 4 increases as the size ofthe substrate 1 increases, thereby increasing costs of the sputteringapparatus. To uniformly deposit target particles out to an edge regionof the substrate 1, the target devices 4 are provided such that thetotal distribution width d2 of the target devices 4 is greater than thewidth “d1” of the substrate 1. Thus, the size of the sputteringapparatus is actually greater than the size of the substrate 1.

The target devices 4 are affixed to an external wall or a support suchthat the target devices 4 do not move or rotate in any direction. Targetparticles emitted from each of the targets 5 are deposited on portionsof the facing substrate 1 respectively facing each of the targets. FIG.2 is a schematic cross-sectional view showing the propagation directionsof target particles that are emitted from targets of the related artsputtering apparatus. As shown in FIG. 2, the target 5 is impacted byAr⁺ ions located at the front of the target 5 such that target particlesare emitted from the target 5 in a slightly spread distribution patternand deposit on the facing substrate 1. Because of the slightly spreaddistribution pattern, target particles from adjacent targets 5 adjacentto each other can be deposited on the same portion of the substrate 1.Accordingly, as shown in FIG. 3, more target particles are deposited onfirst portions p1 of the substrate 1, which are directly opposite toboundary regions between adjacent targets 5, than on second regions p2of the substrate 1, which are directly opposite to the targets 5.Consequently, a layer 9 formed on the substrate 1 from the targetparticles has an uneven surface. Such an uneven layer 9 has poorperformance in terms of operational characteristics and image-qualitycharacteristics.

SUMMARY OF THE INVENTION

Accordingly, embodiments of the present invention are directed to asputtering apparatus, a method of operating the same, and a method ofmanufacturing a substrate using the same that substantially obviate oneor more problems due to limitations and disadvantages of the relatedart.

An object of embodiments of the present invention is to provide asputtering apparatus with a reduced size, a method of operating thesame, and a method of manufacturing a substrate using the same.

Another object of the present invention is to provide a sputteringapparatus capable of reducing costs, a method of operating the same, anda method of manufacturing a substrate using the same.

Another object of the present invention is to provide a sputteringapparatus capable of providing uniformity, a method of operating thesame, and a method of manufacturing a substrate using the same.

Additional advantages, objects, and features of the invention will beset forth in part in the description which follows and in part willbecome apparent to those having ordinary skill in the art uponexamination of the following or may be learned from practice of theinvention. The objectives and other advantages of the invention may berealized and attained by the structure particularly pointed out in thewritten description and claims hereof as well as the appended drawings.

To achieve these objects and other advantages and in accordance with thepurpose of the invention, as embodied and broadly described herein,there is provided a sputtering apparatus having a susceptor forreceiving a substrate, and a first target device disposed to be oppositeto a center region of a substrate and at least second and third targetdevices disposed to be opposite to peripheral regions of the substrate,wherein the second and third target devices emit target particles innon-fixed directions so as to form a substantially uniform sputteredlayer on the substrate.

In another aspect of the present invention, there is provided a methodof operating a sputtering apparatus, which includes a substrate on asusceptor, a first target device disposed opposite to a center region ofa substrate and at least second and third target devices disposedopposite to peripheral regions of the substrate, the method includesrotating each of the second and third rotatable target devices in afirst direction during a first operating period, and rotating each ofsecond and third rotatable target devices in a second direction during asecond operating period.

In yet another aspect of embodiments of the present invention, there isprovided a method of manufacturing a substrate using a sputteringapparatus, including susceptor, a first target device disposed oppositeto a center region of a substrate and at least second and third targetdevices disposed opposite to peripheral regions of the substrate, themethod includes seating the substrate on the susceptor, rotating thesecond and third target devices, and depositing a material on thesubstrate using the rotating second and third devices.

It is to be understood that both the foregoing general description andthe following detailed description of the present invention areexemplary and explanatory and are intended to provide furtherexplanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this application, illustrate embodiment(s) of the invention andtogether with the description serve to explain the principle of theinvention. In the drawings:

FIG. 1 is a cross-sectional view of a sputtering apparatus according tothe related art;

FIG. 2 is a schematic cross-sectional view showing the propagationdirections of target particles that are emitted from targets of therelated art sputtering apparatus;

FIG. 3 is a cross-sectional view showing the shape of a layer that isformed on a substrate manufactured using the related art sputteringapparatus;

FIG. 4 is a plan view of a sputtering apparatus according to a firstembodiment of the present invention;

FIG. 5A is a cross-sectional view taken along a line A-A′ of FIG. 4;

FIG. 5B is a cross-sectional view taken along a line B-B′ of FIG. 4;

FIG. 6 is a plan view of a sputtering apparatus according to a secondembodiment of the present invention;

FIG. 7A is a cross-sectional view taken along a line A-A′ of FIG. 6;

FIG. 7B is a cross-sectional view taken along a line B-B′ of FIG. 6;

FIG. 8 is a schematic cross-sectional view showing a case where thesub-target devices of FIG. 6 rotate in the same direction;

FIG. 9 is a schematic cross-sectional view showing a case where thesub-target devices of FIG. 6 rotate in opposite directions from eachother;

FIG. 10 is a schematic cross-sectional view showing a case where thesub-target devices of FIG. 6 rotate at different times to differentorientation angles; and

FIG. 11 is a cross-sectional view showing a case where the sub-targetdevices of FIG. 6 rotate and shift.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Reference will now be made in detail to the preferred embodiments of thepresent invention, examples of which are illustrated in the accompanyingdrawings. Wherever possible, the same reference numbers will be usedthroughout the drawings to refer to the same or like parts.

FIG. 4 is a plan view of a sputtering apparatus according to a firstembodiment of the present invention. FIG. 5A is a cross-sectional viewtaken along line A-A′ of FIG. 4. FIG. 5B is a cross-sectional view takenalong line B-B′ of FIG. 4. Referring to FIGS. 4, 5A and 5B, thesputtering apparatus according to the first embodiment includes asusceptor (not shown) and a plurality of target devices 21 to 25 thatare disposed to face the susceptor. A substrate 27 is can be positionedon the susceptor with a positive voltage supplied to the susceptor. Eachof the target devices 21 to 25 includes a target (not shown), a bakingplate (not shown), and a magnet (not shown). A negative voltage can besupplied to the target such that target particles are emitted from thetarget. The baking plate dissipates heat from the target. The magnetinduces formation of a high-density plasma. The target, the bakingplate, and the magnet are known in the related art and thus a detaileddescription of these components will be omitted for conciseness.

The first target device 21 is disposed at a center region and is affixedto, for example, a chamber (not shown) of the sputtering apparatus. Thesecond to fifth target devices 22 to 25 are each rotatable about axesparallel to the substrate 27 and are disposed adjacent to the firsttarget device 21. The first to fifth target devices 21 to 25 can bedisposed in the same plane. If necessary, the first target device 21 canalso be rotatable. In the case of the first target device 21 beingrotatable, the first target device 21 may be at first orientation duringa first operating period, and then rotated to be at a second orientationduring a second operating period.

The following description will be given presuming that the first targetdevice 21 does not rotate, but embodiments of the present invention arenot limited to this. That is, the first target device 21 may rotate.Each of the first to fifth target devices 21 to 25 has the shape of arectangle elongated in one of two directions. The rectangular shape ismerely an exemplary embodiment, each of the first to fifth targetdevices 21 to 25 can have other shapes, such as a square or around-edged rectangle.

As shown in FIG. 4, the first target device 21 has a rectangular shapeelongated in a first direction. In addition, second and third targetdevices 22 and 23 are arranged on the short lateral sides of the firsttarget device 21 and have a rectangular shape elongated in the seconddirection perpendicular to the first direction, and fourth and fifthtarget devices 24 and 25 are arranged on the long lateral sides of thefirst target device 21 and have a rectangular shape elongated in thefirst direction. Because it is presumed that the first target device 21does not rotate, a shaft to rotate the first target device 21 is notaffixed to the first target device 21. However, when the first targetdevice 21 is rotatable, a shaft having an axial direction in the firstdirection is affixed to the first target device 21.

Because the second to fifth target devices 22 to 25 are rotatable,shafts 26 a, 26 b, 26 c and 26 d are attached to the second to fifthtarget devices 22 to 25. The shafts 26 a, 26 b, 26 c and 26 d areattached to the second to fifth target devices 22 to 25 so as to beparallel to the longer lateral sides of the second to fifth targetdevices 22 to 25. More specifically, the second to fifth target devices22 to 25 rotate back and forth in clockwise or counterclockwisedirections by a predetermined rotation angle. For example, the rotationangle of the second to fifth target devices 22 to 25 can be in the rangeof 0° to 45°. Accordingly, the second to fifth target devices 22 to 25can rotate clockwise by a rotation angle of 0° to 45° orcounterclockwise by a rotation angle of 0° to 45°. The shafts 26 a, 26b, 26 c and 26 d may be affixed to the second to fifth target devices 22to 25 so as to be parallel to the substrate 27 and spaced apart from thesubstrate 27 by a predetermined distance.

As described above, when the second to fifth target devices 22 to 25have the shape of a rectangle, each of the shafts 26 a, 26 b, 26 c and26 d can be respectively attached to the second to fifth target devices22 to 25 to have an axial direction same as a direction of the longlateral sides of the target device to which each shaft is attached. Inother words, the axial direction of the shafts 26 a and 26 b for thesecond and third target devices 22 and 23 is perpendicular to anotheraxial direction of the shafts 26 c and 26 d for the fourth and fifthtarget devices 24 and 25. Accordingly, the axial direction of the shafts26 c and 26 d installed in the fourth and fifth target devices 24 and 25is in the first direction and the axial direction of shafts 26 a and 26b attached to the second and third target devices 22 and 23 are in thesecond direction perpendicular to the first direction.

As shown in FIG. 5A, the first to third target devices 21 to 23 alongthe first direction has the dimensions of the first target device 21with a lateral width “a”, the second target device 22 with alongitudinal width “b”, the third target device 23 with a longitudinalwidth “c”, the gap “d” between the first and second target devices 21and 22, and the gap “e” between the first and third target devices 21and 23. Consequently, the width “f” is the total dimension along thefirst direction for the first to third target devices 21 to 23.

As shown in FIG. 5B, the first, fourth and fifth target devices 21, 24and 25 are arranged along the second direction has the dimensions of thefirst target device 21 with a longitudinal width “h”, the fourth targetdevice 24 with a longitudinal width “i”, the fifth target device 25 witha longitudinal width “j”, the gap “k” between the first and fourthtarget devices 21 and 24, and the gap “l” between the first and fifthtarget devices 21 and 25. Consequently, the width “m” is the totaldimension along the second direction for the first, fourth and fifthtarget devices 21, 24 and 25.

The substrate 27 has a lateral width “g” in a first direction and alongitudinal width “n” in a second direction. For example, the lateralwidth “g” is greater than the longitudinal width “n”. In this case, thetotal width “f” of the first to third target devices 21 to 23 is smallerthan the lateral width “g” of the substrate 27, and the total width “m”of the first, fourth and fifth target devices 21, 24 and 25 is smallerthan the longitudinal width “n” of the substrate 27. In addition, thelateral width “b” of the second target device 22 is smaller than the gap“d” between the first and second target devices 21 and 22, and thelateral width “c” of the third target device 23 is smaller than the gap“e” between the first and third target devices 21 and 23. Likewise, thelongitudinal width “i” of the fourth target device 24 is smaller thanthe gap “k” between the first and fourth target devices 21 and 24, andthe longitudinal width “j” of the fifth target device 25 is smaller thanthe gap “l” between the first and fifth target devices 21 and 25.

The substrate can be larger than the sputtering apparatus because thesecond to fifth target devices 22 to 25 can pivot or rotate. That is,when the second to fifth target devices 22 are 25 rotated to pivot intoone orientation and then rotated again to pivot into a secondorientation, target particles can be distributed onto portions of thesubstrate other than directly opposite to the second and fifth targetdevices 22 to 25. Thus, the total width “f” and “m” can be smaller thanthe width “g” and “n” and the width “b”, “c”, “i” and “j” can be smallerthan the gap “d”, “e”, “k” and “l”.

The following description will be given assuming that each of the firstto fifth target devices 21 to 25 has the shape of a rectangle, butembodiments of the present invention are not limited thereto. The secondto fifth target devices 22 to 25 rotate back and forth between first andsecond orientations on the shafts 26 a, 26 b, 26 c and 26 d. The shafts26 a, 26 b, 26 c and 26 d can be attached to the second to fifth targetdevices 22 to 25 in such a way that the axial direction is parallel tothe substrate 27 along its length direction. For example, the second tofifth target devices 22 to 25 may rotate clockwise from the firstorientation to the second orientation during the first operating period,and counterclockwise from the second orientation to the firstorientation during the second operating period. These rotations may beperformed repeatedly.

At the first orientation of the second and third target devices 22 and23, target particles emitted from the second and third target devices 22and 23 can be deposited on regions of the substrate at one side ofportions of the substrate 27 that are directly opposite to the secondand third target devices 22 and 23. In addition, at the secondorientation of the second and third target devices 22 and 23, targetparticles emitted from the second and third target devices 22 and 23 canbe deposited on other regions of the substrate at another side ofportions of the substrate 27 that are directly opposite to the secondand third target devices 22 and 23. Likewise, at the first orientationof the fourth and fifth target devices 24 and 25, target particlesemitted from the fourth and fifth target devices 24 and 25 can bedeposited on regions of the substrate at one side of portions of thesubstrate 27 that are directly opposite to the fourth and fifth targetdevices 24 and 25. In addition, at the second orientation of the fourthand fifth target devices 24 and 25, target particles emitted from thefourth and fifth target devices 24 and 25 can be deposited on otherregions of the substrate at another side of portions of the substrate 27that are directly opposite to the fourth and fifth target devices 24 and25.

The rotations of the second to fifth target devices 22 to 25 create auniform thin film on areas of the substrate that are not directlyopposite to the second to fifth target devices 22 to 25. Accordingly,because the total width “f” and “m” can be smaller than the width “g”and “n”, and the gap “d”, “e”, “k” and “l” can be greater than the width“b”, “c”, “i” and “j”, the number of the target devices can be reducedand thus the manufacturing cost can be reduced. In addition, the totalwidth “f” and “m” and thus the total volume of the sputtering device canbe reduced, thereby reducing the occupation area.

FIG. 6 is a plan view of a sputtering apparatus according to a secondembodiment of the present invention. FIG. 7A is a cross-sectional viewtaken along a line A-A′ of FIG. 6. FIG. 7B is a cross-sectional viewtaken along a line B-B′ of FIG. 6. The second embodiment isfundamentally similar to the first embodiment with the exception thateach of the second to fifth target devices 22 to 25 includes a pluralityof sub-target devices. For example, the second target device 22 includesa plurality of sub-target devices 22 a and 22 c, the third target device23 includes a plurality of sub-target devices 23 a and 23 c, the fourthtarget device 24 includes a plurality of sub-target devices 24 a and 24c, and the fifth target device 25 includes a plurality of sub-targetdevices 25 a and 25 c.

FIGS. 6, 7A and 7B illustrate that the first target device 21 isprovided as a single device. However, the first target device 21 mayinclude a plurality of sub-target devices. The plurality of sub-targetdevices of the second to fifth target devices 22 to 25 rotate abouttheir shaft (not shown). The following description will be givenassuming that no shaft is installed in the first target device 21 andthus the first target device 21 cannot rotate. However, when the firsttarget device 21 rotates, a shaft can be attached to the first targetdevice 21. The second to fifth target devices 22 to 25 operate in asimilar manner. The following description will focus on, for example,the third target device 23 for conciseness, which can have first tofifth sub-target devices.

FIG. 8 is a schematic cross-sectional view showing a case where thesub-target devices of FIG. 6 rotate in the same direction. Referring toFIG. 8, the first to fifth sub-target devices 31 a to 31 e of the thirdtarget device 23 can rotate in the same direction by the same rotationangle. For example, all of the first to fifth sub-target devices 31 a to31 e may rotate clockwise to a first orientation angle “α” with respectto normal during a first operating period, and counterclockwise to asecond orientation angle “β” with respect to normal during a secondoperating period. The first and second orientation angles “α” and “β”can be the same size. A uniform layer can be formed on portions of thesubstrate 27 directly opposite to the sub-target device 31 a to 31 e andregions of the substrate 27 outside of portions of the substrate 27directly opposite to the sub-target device 31 a to 31 e. Each of thefirst and second orientation angles “α” and “β” can be in the range of0° to 45°. When each of the first and second orientation angles “α” and“β” is greater than 45°, interference may occur between the adjacenttarget devices, thereby obstructing the formation of a uniform layer.

FIG. 9 is a schematic cross-sectional view showing a case where thesub-target devices of FIG. 6 rotate in opposite directions from eachother. Referring to FIG. 9, the first to fifth sub-target devices 31 ato 31 e can alternately rotate in opposite directions from each other.For example, the first sub-target device 31 a rotates clockwise to afirst orientation angle “α”, the second sub-target device 31 b rotatescounterclockwise to a second orientation angle “β”, the third sub-targetdevice 31 c rotates clockwise to the first orientation angle “α”, thefourth sub-target device 31 d rotates counterclockwise to the secondorientation angle “β”, and the fifth sub-target device 31 e rotatesclockwise to the first orientation angle “α”. The first and secondorientation angles “α” and “β” can be identical in size. Each of thefirst and second orientation angles “α” and “β” can be in the range of0° to 45′.

FIG. 10 is a schematic cross-sectional view showing a case where thesub-target devices of FIG. 6 rotate in different directions to differentorientation angles. Referring to FIG. 10, the first to fifth sub-targetdevices 31 a to 31 e can rotate in different directions to differentorientation angles. For example, the first sub-target device 31 arotates clockwise to a first orientation angle “α1”, the secondsub-target device 31 b rotates clockwise to a second orientation angle“α2”, the third sub-target device 31 c rotates counterclockwise to athird orientation angle “β1”, the fourth sub-target device 31 d rotatesclockwise by a fourth orientation angle “β3”, and the fifth sub-targetdevice 31 e rotates counterclockwise to a fourth orientation angle “β2”.

FIG. 11 is a cross-sectional view showing a case where the sub-targetdevices of FIG. 6 rotate and shift. Referring to FIG. 11, the first tofifth sub-target devices 31 a to 31 e can rotate clockwise orcounterclockwise and simultaneously can shift in a direction parallel tothe substrate 27. For example, during a first operating period, thefirst to fifth sub-target devices 31 a to 31 e shift in the leftdirection and simultaneously rotate clockwise or counterclockwise, sothat target particles can be uniformly deposited across to one side ofthe substrate 27. Thereafter, during a second operating period, thefirst to fifth sub-target devices 31 a to 31 e shift in the rightdirection and simultaneously rotate clockwise or counterclockwise, sothat target particles can be uniformly deposited across to the otherside of the substrate 27.

By rotating or shifting the target devices, embodiments of the presentinvention reduce the total width of the target devices in relation tothe width of the substrate so as to reduce the size of the sputteringapparatus. Also, by rotating or shifting the target devices, embodimentsof the present invention can reduce the number of target devices so asto reduce the manufacturing cost because a single targeting device cancover more area of the substrate.

According to embodiments of the present invention, a target device isdisposed to be opposite to the center region of the substrate and othertarget devices are disposed to be opposite to peripheral regions (i.e.,the left, right, upper and lower regions) of the substrate adjacent tothe center region. In this case, the target devices opposite to theperipheral regions can rotate. Accordingly, a uniform layer can beformed on the substrate, thereby providing for high reliability.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present invention. Thus,it is intended that the present invention covers the modifications andvariations of this invention provided they come within the scope of theappended claims and their equivalents.

1. A method of operating a sputtering apparatus, which includes a substrate on a susceptor, a first target device having an elongated shape in a first direction and disposed on a first region of the substrate opposite to a center region of a substrate, at least second and third target devices each having an elongated shape in a second direction perpendicular to the first direction and disposed on second and third regions of the substrate opposite to opposite first and second side regions of the substrate, and at least fourth and fifth target devices each having an elongated shape in the first direction and disposed on fourth and fifth regions of the substrate opposite to opposite third and fourth side regions of the substrate, the method comprising: rotating each of the second and third target devices and each of the fourth and fifth target devices clockwise during a first operating period; and rotating each of the second and third target devices and each of the fourth and fifth target devices counterclockwise during a second operating period, wherein the second and third target devices are rotated with respect to first axes parallel to the second direction and the fourth and fifth target devices are rotated with respect to second axes parallel to the first direction.
 2. The method according to claim 1, wherein the second and third target devices rotate in opposite directions from each other to first and second orientation angles, and the fourth and fifth target devices rotate in opposite directions from each other to third and fourth orientation angles.
 3. The method according to claim 2, wherein the first to fourth and second orientation angles are in a range of 0° to 45° with respect to normal, respectively.
 4. The method according to claim 1, wherein each of the second to fourth target devices includes a plurality of sub-target devices.
 5. The method according to claim 4, wherein each of the sub-target devices rotate in different directions.
 6. The method according to claim 4, wherein each of the sub-target devices rotate to different orientation angles.
 7. The method according to claim 1, further comprising shifting each of the second and third target devices in the first direction parallel to the substrate during the first operating period and the second operating period, and shifting each of the fourth and fifth target devices in the second direction during the first operating period and the second operating period.
 8. A method of manufacturing a substrate using a sputtering apparatus, including a susceptor, a first target device having an elongated shape in a first direction and disposed on a first region of the substrate opposite to a center region of a substrate, at least second and third target devices each having an elongated shape in a second direction perpendicular to the first direction and disposed on second and third regions of the substrate opposite to opposite first and second side regions of the substrate, and at least fourth and fifth target devices each having an elongated shape in the first direction and diposed on fourth and fifth regions of the substrate opposite to opposite third and fourth side regions of the substrate, the method comprising: seating the substrate on the susceptor; rotating each of the second and third target devices and each of the fourth and fifth target devices clockwise during a first operating period; rotating each of the second and third target devices and each of the fourth and fifth target devices counterclockwise during a second operating period; and depositing a material on the substrate using the first to fifth devices, wherein the second and third target devices are rotated with respect to first axes parallel to the second direction and the fourth and fifth target devices are rotated with respect to second axes parallel to the first direction.
 9. The method according to claim 8, furthers comprising shifting the second and third target devices in the first direction parallel to the substrate while depositing the material, and shifting each of the fourth and fifth target devices in the second direction during the first operating period and the second operating period while depositing the material.
 10. The method according to claim 1, wherein the first to fifth target devices have the same interval from the substrate.
 11. The method according to claim 8, wherein the first to fifth target devices have the same interval from the substrate. 